It applies its advanced Non-Destructive Testing (NDT) and Non-Invasive imaging technology to the agricultural sector through its Industrial Radiography Mango Inspection Machine.

For premium export-quality fruits like mangoes, visual and optical surface sorting is insufficient because the most severe defects occur hidden deep inside the flesh. Karma Innovations designs customized, HACCP-compliant, online digital X-ray inspection systems. These food-grade systems non-destructively "see through" the mangoes at high processing speeds. This enables exporters and food processors to detect internal physiological disorders, seed defects, and foreign contaminants without altering the organic integrity, flavor, or shelf life of the fruit, thereby safeguarding brand reputation in strict international export markets.

Critical Defects Detected in Mangoes

By utilizing advanced low-contrast digital radiography sensors, our systems identify internal anomalies that cannot be caught by visual inspection:

• Spongy Tissue: A major physiological disorder where the flesh around the stone develops a yellowish, sour, spongy patch with gas pockets.
• Seed Borer & Weevil Infestations: Hidden internal cavities, larvae, or insects tunneling inside the mango seed or surrounding pulp.
• Internal Cavities & Hollow Heart: Voids or air pockets formed during growth or rapid maturation cycles.
• Fruit Rot & Internal Breakdown: Premature tissue degradation or blackening around the stone before surface bruising shows.
• Foreign Body Contaminants: Embedded field debris such as glass pieces, small stones, or metal fragments introduced during harvesting and bulk transport.

Components of the Mango Inspection System

The complete Mango Inspection Machine functions as an automated, integrated system consisting of several key components:

1. The X-Ray Imaging Core

• High-Stability X-Ray Source (160kV): A finely tuned, low-energy radiation source safe for food processing that offers the precise penetration depth needed for soft organic fruit flesh.
• High-Resolution Digital Detector Array (DDA): Multi-megapixel, ultra-sensitive digital linear or flat-panel sensors that capture sharp internal density cross-sections in fractions of a second.

2. Conveyor & Handling Mechanization

• Food-Grade Automated Conveyor: Built with HACCP-compliant, easy-to-clean materials that move the mangoes smoothly across the inspection zone without causing external bruising or damage.

Components Inspected Under This System

It has multi-axis micro-focus and radiography systems to test a broad taxonomy of electrical and electronic assets:

1. Printed Circuit Board Assemblies (PCBAs) & Semiconductor Packages

• BGA & QFN Packages: Inspecting hidden solder joints under Ball Grid Arrays and Quad Flat No-leads packages that are completely invisible to optical cameras.
• Multi-Layer PCBs: Checking alignment across buried vias, through-holes, and tracking paths in complex multi-layer electronic boards.
• Wire Bond Assemblies: Micro-focal evaluation of ultra-fine wire connections in semiconductor packaging and power modules.

2. Power Electronics & EV Components

• IGBT Modules: Inspecting the large-area solder or sinter layers under Insulated-Gate Bipolar Transistors used in EV motor controllers and solar inverters to prevent thermal runaway.
• Lithium-Ion Battery Packs: Assessing internal anode-cathode alignment, tab welding quality, and casing integrity.

3. Electrical Distribution & Switchgear Components

• HRC (High Rupturing Capacity) Fuses: Verifying the presence and correct positioning of internal element links and quartz sand filling uniformity.
• Solenoids & Relay Coils: Checking the density of wound copper coils and identifying sub-surface damage in winding insulation.
• Epoxy Molded Parts: Scanning heavy-duty resin-cast bushings, current transformers, and insulated brackets for trapped air pockets that could cause electrical arcing or dielectric breakdown.

Ceramic Insulators: Inspecting high-voltage industrial ceramic components for internal cracks or structural flaws before grid deployment.